ABOUT

Founded in 2007, Daspect is the leading advanced semiconductor organisation on the island of Ireland.

As the semiconductor industry reaches capacity with the diminishing returns of Moore’s Law, the industry-established method of single-die processors has become increasingly costly with restrictive yields.

By combining smaller dies and specialised silicon in heterogeneous integration (chiplets). Daspect pushes the industry forward with advanced 3D microbump stacking of components with ultra-high-density interconnects.

The tired tropes of legacy semiconductor branding with navy and blue gradients, generic silicon wafers, and staged technical clean-room specialist photography have dated poorly.

Daspect requires a modern facing visual identity that elevates the company beyond that of a
vendor to an architect of structural computation.